Method of manufacturing light emitting device

ABSTRACT

A method of manufacturing a light emitting device includes: providing a light emitting element including a light extraction surface, an electrode-formed surface on a side opposite to the light extraction surface, lateral surfaces positioned between the light extraction surface and the electrode-formed surface, and a pair of electrodes on the electrode-formed surface; providing a covering member including a lens portion and a first recess on a side different from the lens portion; disposing the light emitting element on a bottom surface of the first recess, with the light extraction surface and the bottom surface of the first recess facing each other; and forming a reflective member in the first recess to cover the lateral surfaces of the light emitting element while at least a part of the pair of electrodes is exposed from the reflective member.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. patent applicationSer. No. 16/733,989, filed on Jan. 3, 2020, which is a divisionalapplication of U.S. patent application Ser. No. 15/783,514, filed onOct. 13, 2017, now U.S. Pat. No. 10,559,724. This application claimspriority to Japanese Patent Application No. 2016-205208, filed on Oct.19, 2016. The entire disclosures of U.S. patent application Ser. No.16/733,989 and Ser. No. 15/783,514 and Japanese Patent Application No.2016-205208 are hereby incorporated herein by reference.

BACKGROUND

The present disclosure relates to a light emitting device and a methodof manufacturing the same.

It is expected for lighting devices using semiconductor light emittingelements such as light emitting diodes (LED) to exhibit higherperformance and higher reliability.

For example, Japanese Patent Publication No. H10-151794 A discloses alight emitting device, which attains high reliability by including: anLED chip disposed on a light-transmissive supporting body via alight-transmissive adhesive agent; and a conductive wire thatelectrically connects an electrode provided on a surface of the LED chipopposite to the surface being in contact with the light-transmissiveadhesive agent and an external electrode provided at thelight-transmissive supporting body.

SUMMARY

In the light emitting device disclosed in Japanese Patent PublicationNo. H10-151794 A, the electrode of the LED chip and the externalelectrode provided at the light-transmissive supporting body areconnected to each other with the conductive wire, therefore, the heatdissipating path is long. Hence, there is a demand of a light emittingdevice that exhibits a good heat dissipation property.

One of objects of certain embodiments of the present disclosure is toprovide a light emitting device that exhibits a good heat dissipationproperty and a method of manufacturing the same.

A method of manufacturing a light emitting device according to oneembodiment includes: providing a light emitting element including alight extraction surface, an electrode-formed surface on a side oppositeto the light extraction surface, lateral surfaces positioned between thelight extraction surface and the electrode-formed surface, and a pair ofelectrodes on the electrode-formed surface; providing a covering memberincluding a lens portion and a first recess on a side different from thelens portion; disposing the light emitting element on a bottom surfaceof the first recess, with the light extraction surface and the firstrecess facing each other; and forming a reflective member in the firstrecess to cover the lateral surfaces of the light emitting element whileat least a part of the pair of electrodes is exposed from the reflectivemember.

Certain embodiments of the present disclosure provide a light emittingdevice that exhibits a good heat dissipation property and a method ofmanufacturing the same.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a top view showing the schematic structure of a lightemitting device according to a first embodiment.

FIG. 1B is a section view taken along line A-A in FIG. 1A.

FIG. 1C is a schematic section view of a variation of the light emittingdevice according to the first embodiment.

FIG. 2A is a schematic section view of a light emitting device accordingto a second embodiment.

FIG. 2B is a schematic section view of a variation of the light emittingdevice according to the second embodiment.

FIG. 3A is a top view showing the schematic structure of a lightemitting device according to a third embodiment.

FIG. 3B is a section view taken along line B-B in FIG. 3A.

FIG. 4A is a top view showing the schematic structure of a lightemitting device according to a fourth embodiment.

FIG. 4B is a section view taken along line C-C in FIG. 4A.

FIG. 5A is a top view showing the schematic structure of a lightemitting device according to a fifth embodiment.

FIG. 5B is a section view taken along line D-D in FIG. 5A.

FIG. 6A is a top view showing the schematic structure of a lightemitting device according to a sixth embodiment.

FIG. 6B is a section view taken along line E-E in FIG. 6A.

FIG. 7A is a top view showing the schematic structure of a lightemitting device according to a seventh embodiment.

FIG. 7B is a section view taken along line F-F in FIG. 7A.

FIG. 8A is a top view showing the schematic structure of a lightemitting device according to an eighth embodiment.

FIG. 8B is a section view taken along line G-G in FIG. 8A.

FIG. 9A is a schematic section view showing a method of manufacturingthe light emitting device according to the second embodiment.

FIG. 9B is a schematic section view showing the method of manufacturingthe light emitting device according to the second embodiment.

FIG. 9C is a schematic section view showing the method of manufacturingthe light emitting device according to the second embodiment.

FIG. 10A is a schematic section view showing a method of manufacturingthe light emitting device according to the third embodiment.

FIG. 10B is a schematic section view showing the method of manufacturingthe light emitting device according to the third embodiment.

FIG. 11A is a schematic section view showing a method of manufacturingthe light emitting device according to the fourth embodiment.

FIG. 11B is a schematic section view showing the method of manufacturingthe light emitting device according to the fourth embodiment.

FIG. 12A is a schematic section view showing a method of manufacturingthe light emitting device according to the eighth embodiment.

FIG. 12B is a schematic section view showing the method of manufacturingthe light emitting device according to the eighth embodiment.

DETAILED DESCRIPTION OF EMBODIMENTS

In the following, with reference to the drawings as appropriate, adescription will be given of embodiments of the present disclosure. Notethat, a light emitting device and a method of manufacturing the same aredescribed in the following for embodying the technical idea, and thedescription does not specify the present disclosure to the followingunless otherwise specified. Further, a description in one embodimentholds true for other embodiment.

Further, in the following description, identical or similar members aredenoted by identical name and reference sign, and a detailed descriptionthereof will be omitted as appropriate. Further, as to the constituentsof the present disclosure, a plurality of elements may be formed by anidentical member so that the one member also serves as the plurality ofelements. Conversely, the function of one member may be realized asbeing shared by a plurality of members.

First Embodiment

FIG. 1A is a top view showing the schematic structure of a lightemitting device 1000 according to the first embodiment. FIG. 1B is asection view taken along line A-A in FIG. 1A. The light emitting device1000 includes: a light emitting element 10, a reflective member 20, acovering member 40. The light emitting element 10 includes a lightextraction surface 101, an electrode-formed surface 102 on the sideopposite to the light extraction surface 101, lateral surfacespositioned 103 between the light extraction surface 101 and theelectrode-formed surface 102, and a pair of electrodes 11, 12 on theelectrode-formed surface 102. The pair of electrodes 11, 12 of the lightemitting element 10 is exposed outside. The reflective member 20 is incontact with at least part of the light emitting element 10 to cover thelateral surfaces 103 of the light emitting element while exposing thepair of electrodes 11, 12 The covering member 40 includes a lens portion401 at its upper surface, and is in contact with the reflective member20 to cover the light emitting element 10 and the reflective member 20.Further, the light emitting element 10 and the covering member 40 arejoined to each other via a first light-transmissive member 30.

In the present embodiment, the pair of electrodes 11, 12 of the lightemitting element 10 are exposed outside the light emitting device,thereby enabling the heat dissipating path to be shortened. Thus, heatgenerated at the light emitting element is efficiently dissipated to amounting board on which the light emitting element is mounted.Accordingly, the light emitting device according to the presentembodiment exhibits a better heat dissipation property as compared to adevice including a heat dissipating path which also serves as anexternal electrode provided at a supporting body on which a lightemitting element is mounted.

Light Emitting Element 10

The light emitting element may be a known semiconductor light emittingelement, such as the one configured with a nitride semiconductor or thelike. The light emission wavelength of the light emitting element can beselected from the ultraviolet region to the infrared region includingthe visible region (i.e., 380 nm to 780 nm). Examples of a lightemitting element having a peak wavelength of 430 nm to 490 nm include anitride semiconductor. The nitride semiconductor may beIn_(X)Al_(Y)Ga_(1-X-Y)N (0≤X, 0≤Y, X+Y≤1) or the like. The lightemitting element 10 includes a light-transmissive substrate 14, asemiconductor layered body 13, and the pair of electrodes 11, 12.

Further, the light emitting element 10 includes the light extractionsurface 101, the electrode-formed surface 102 on the side opposite tothe light extraction surface 101, and the lateral surface 103 betweenthe light extraction surface 101 and the electrode-formed surface 102.The light emitting element 10 includes the pair of electrodes 11, 12 inthe electrode-formed surface 102. A shape of the pair of electrodes 11,12 may be appropriately selected. In the present embodiment, the lightextraction surface 101 can be referred to as the upper surface of thelight-transmissive substrate 14, and the electrode-formed surface 102can be referred to as the lower surface of the semiconductor layeredbody 13.

Reflective Member 20

The reflective member reflects light from the light emitting element.Covering the lateral surface of the light emitting element, thereflective member reflects light emitted in the lateral direction (i.e.,X direction or Y direction) from the light emitting element, so that thelight changes its traveling direction and travels upward from the lightemitting element (i.e., Z direction). Thus, the ratio of the lighttraveling upward from the light emitting element can be increased withrespect to the light emitted from the light emitting element, wherebythe light extraction efficiency of the light emitting device improves.

The reflective member is in contact with at least part of the lightemitting element. The reflective member may be in contact with the pairof electrodes of the light emitting element, or with theelectrode-formed surface of the light emitting element. The reflectivemember may be in contact with the lateral surface of the light emittingelement. The reflective member being in contact with at least part ofthe light emitting element allows the light emitted from the lightemitting element to be increasingly reflected at the reflective member,as compared to the case where the reflective member is spaced apart fromthe light emitting element. The reflective member 20 being in contactwith the electrode-formed surface 102 reduces a probability of lightleaking downward from the light emitting element, whereby the lightextraction efficiency of the light emitting device improves.

The reflective member may be configured with a light-reflective resin.The light-reflective resin refers to resin that exhibits highreflectivity to light from the light emitting element, e.g., areflectivity of 70% or higher. The light-reflective resin may be, forexample, a light-transmissive resin in which a light-reflectivesubstance is dispersed. The light-reflective substance may be, forexample, titanium oxide, aluminum oxide, zirconium oxide, magnesiumoxide or the like. The light-reflective substance may be granular,fibrous, flaky or the like. The resin material contained in thelight-reflective resin is preferably thermosetting light-transmissiveresin such as silicone resin, silicone modified resin, epoxy resin,phenolic resin or the like. In particular, silicone resin is suitabledue to its light resistance and heat resistance.

First Light-Transmissive Member 30

First light-transmissive member is a material for joining the lightemitting element 10 and the covering member 40 to each other. When thelight emitting device includes a wavelength conversion member to bedescribed later, the first light-transmissive member joins the lightemitting element 10 and the wavelength conversion member to each other.By virtue of the provision of the first light-transmissive member, thelight emitting element 10 and the covering member 40 are easily joinedto each other. The first light-transmissive member 30 may be located onmerely a position between the light extraction surface 101 of the lightemitting element 10 and the covering member 40 in order to join thelight emitting element 10 and the covering member 40 to each other.Alternatively, the first light-transmissive member 30 may cover thelight extraction surface 101 of the light emitting element 10 and thelateral surfaces 103 of the light emitting element 10, in order to jointhe light emitting element 10 and the covering member 40 to each other.It is preferable that the first light-transmissive member 30 covers thelight extraction surface 101 of the light emitting element 10 and thelateral surfaces 103 of the light emitting element 10, because itimproves adhesion between the light emitting element 10 and the coveringmember 40. The first light-transmissive member 30 has a lighttransmissivity higher than that of the reflective member 20 with respectto light emitted from the light emitting element 10. Therefore, thefirst light-transmissive member 30 preferably covers thelight-transmissive substrate 14 and the lateral surfaces of thesemiconductor layered body 13. In this manner, light emitted from thelateral surfaces of the light emitting element 10 is readily extractedto the outside of the light emitting device via the firstlight-transmissive member 30, whereby the light extraction efficiencyimproves.

The first light-transmissive member 30 may be configured with alight-transmissive resin. Preferably, the material of the firstlight-transmissive member 30 may be, in particular, a thermosettinglight-transmissive resin such as silicone resin, silicone modifiedresin, epoxy resin, or phenolic resin. The first light-transmissivemember is in contact with the light emitting element, and hence, it issusceptible to heat that is generated by the light emitting element inthe lit state. The thermosetting resin is suitable for the firstlight-transmissive member 30 due to its good heat resistance. Further,the light emitting device exhibiting a good heat dissipation propertycan reduce a probability of deterioration of the firstlight-transmissive member 30 attributed to heat. Thus, a highly reliablelight emitting device can be obtained.

Covering Member 40

The covering member 40 covers the light emitting element 10 and thereflective member 20. By virtue of the provision of the covering member,the light emitting element 10 and the reflective member 20 can beprotected from the external environment, and light output from the lightemitting element 10 can be optically controlled. The covering member 40includes a lens portion 401 that optically controls light output fromthe light emitting element 10. The lens portion of the covering membermay have a known lens shape, such as a convex lens, a concave lens, or aFresnel lens. The covering member 40 may be formed in such a manner asto cover the light emitting element and the reflective member, by aknown method such as compression molding or injection molding. Further,as in a method of manufacturing a light emitting device to be describedlater, the covering member defining a recess may be formed separatelyfrom the light emitting element and the reflective member. By the lightemitting element and the reflective member being disposed in the recessin the formed covering member, the covering member can cover the lightemitting element and the reflective member.

For example, when the lens portion of the covering member is shaped as aconvex lens, preferably an uppermost portion 44 of the lens portion 401and the center of the light emitting element 10 substantially correspondto each other as seen in a plan view. In the present specification, theterm “substantially corresponding to each other” includes a tolerance ofabout ±50 μm. In this manner, the light from the center of the lightemitting element, which is generally most intensive as compared to lightfrom other portions of the light emitting element, is readily controlledby the lens portion.

The light emitting device according to the present embodiment exhibits agood heat dissipation property, and hence is capable of reducing heatapplied to the covering member. This alleviates expansion of thecovering member due to heat, and hence reduces variability in the lightdistribution property of the light emitting device due to heat. Further,the light emitting device exhibiting a good heat dissipation propertyreduces a probability of deterioration of the covering member, and thelike, attributed to heat. Thus, a highly reliable light emitting devicecan be obtained.

In the covering member 40, part of a lower surface 405 on the sideopposite to the lens portion 401 is preferably substantially flush witha lower surface 201 of the reflective member 20. In this manner, thecovering member 40 can cover the entire lateral surface 202 of thereflective member 20, thereby improving adhesion between the coveringmember 40 and the reflective member 20. In the present specification,the term “being substantially flush with each other” includes atolerance of about ±20 μm. Further, as shown in FIG. 1C, part of thelower surface 405 on the side opposite to the lens portion 401 of thecovering member 40 may be covered with the reflective member 20. In sucha case also, the contact area between the covering member 40 and thereflective member 20 is increased, thereby improving adhesion betweenthe covering member 40 and the reflective member 20.

The covering member 40 may contain a wavelength conversion material thatabsorbs light from the light emitting element and re-emits light havinga different wavelength from the light emitted from the light emittingelement. The covering member 40 may contain a diffusing agent fordiffusing light from the light emitting element. The covering member 40functions to control distribution of light from the light source,therefore, the content of each of the wavelength conversion material,the diffusing material, and the coloring agent is preferably within theamount which does not interfere with the light distribution control ofthe covering member 40.

The covering member 40 may be configured with a light-transmissivematerial. The material of the covering member 40 may be alight-transmissive resin such as epoxy resin, silicone resin, a mixturethereof, or glass. Among these examples, silicone resin is preferable inconsideration of light resistance and moldability.

Second Embodiment

FIG. 2A is a schematic section view of a light emitting device 2000according to a second embodiment. The light emitting device 2000according to the present embodiment is different from the light emittingdevice 1000 according to the first embodiment in including conductivemembers 81, 82 electrically connected to a pair of electrodes 11, 12 ofthe light emitting element 10 which respectively include the lowersurfaces 811, 821 exposed outside the light emitting device and areelectrically connected to a pair of electrodes 11, 12. The rest of thestructure is the same as or similar to that of the light emitting device1000 according to the first embodiment.

In the light emitting device 2000, the lower surfaces 811, 821 of theconductive members 81, 82, which are electrically connected to the pairof electrodes 11, 12 of the light emitting element 10, are exposedoutside the light emitting device, thereby allowing the heat dissipatingpath to be shortened. Thus, the light emitting device according to thepresent embodiment exhibits a good heat dissipation property as comparedto a device including a conductive member that is exposed outside thelight emitting device and is provided on/above a supporting body onwhich a light emitting element is mounted.

Conductive Members 81, 82

The conductive members 81, 82 are electrically connected to the pair ofelectrodes 11, 12 of the light emitting element 10, and function as theexternal connection terminals of the light emitting device. By virtue ofthe conductive members 81, 82 functioning as the external connectionterminals, the shape of the external connection terminals can beincreased in size independently of the pair of electrodes 11, 12 of thelight emitting element 10. This improves heat dissipation property ofthe light emitting device. The conductive members 81, 82 may beconfigured with metal.

The lower surfaces 811, 821 of the conductive members 81, 82 refer tothe surfaces opposite to the surfaces opposing to the pair of electrodes11, 12 of the light emitting element 10. By virtue of the lower surfaces811, 821 of the conductive members 81, 82 being exposed outside, eventhough the light emitting device includes the conductive members 81, 82,the thickness of the light emitting device is increased only by thethickness of the conductive members 81, 82. Accordingly, a height of thelight emitting device can be reduced. The thickness of the conductivemembers 81, 82 is preferably 1 μm or smaller, for example.

As shown in FIG. 2B, the light emitting element 10 may include postelectrodes 15, 16 which are respectively in contact with andelectrically connected to the pair of electrodes 11, 12, and have athickness of in a range of 50 μm to 150 μm. When the light emittingdevice is mounted on a mounting board or the like and the mounting boardexpands or contracts due to heat, the post electrodes can reduce stressapplied to the joined part between the light emitting element and themounting board. This contributes to preventing or discouraging the lightemitting element from being detached from the mounting board. Further,the post electrodes 15, 16 also function as heat dissipating paths fordissipating heat generated by the light emitting element 10. The shapeof the post electrodes 15, 16 as seen in a plan view may be any ofvarious shapes formed by combinations of a straight line and/or a curvedline. Further, the post electrodes 15, 16 preferably have substantiallysimilar shape in the thickness direction. With the shape of the postelectrodes 15, 16, the heat emitted by the light emitting element 10 canbe evenly dissipated toward the mounting board from the post electrodes15, 16. Examples of the shape of the post electrodes 15, 16 may be, acircular columnar shape, a rectangular parallelepiped, or a hexagonalcolumnar shape.

The material of the post electrodes 15, 16 of the light emitting element10 may be copper, silver, gold, platinum or the like. In particular,copper is preferably employed as the material of the post electrodes 15,16. Use of copper as the material of the post electrodes 15, 16 improvesthe heat dissipation property, as compared to the case where a materialsuch as gold is employed.

The post electrodes 15, 16 may be printed bumps, stud bumps, or platedbumps which can be formed by electrolytic plating or electrolessplating. Among these examples, plated bumps formed by electrolyticplating are preferable. For example, the post electrodes 15, 16 may beformed by a thickness in a range of from 50 μm to 150 μm by electrolyticcopper plating.

When the light emitting element includes the post electrodes, the lightemitting device may include conductive members that are electricallyconnected to the post electrodes of the light emitting element.

Third Embodiment

FIG. 3A is a top view showing the schematic structure of a lightemitting device 3000 according to a third embodiment. FIG. 3B is across-section view taken along line B-B in FIG. 3A. The light emittingdevice 3000 according to the present embodiment is different from thelight emitting device 1000 according to the first embodiment inincluding a gas portion 50 between the light extraction surface 101 ofthe light emitting element 10 and the covering member 40. The rest ofthe structure is the same as or similar to that of the light emittingdevice 1000 according to the first embodiment.

The gas portion 50 reflects light from the light emitting element at theinterface between the covering member 40 and the gas portion 50, and theinterface between the light extraction surface 101 of the light emittingelement 10 and the gas portion 50. Provision of the gas portion 50facilitates light distribution control of the light emitting device. Thegas portion contains gas such as air or oxygen gas, or inert gas such asnitrogen gas or argon gas. The gas portion may be formed by a gasmixture of air, oxygen gas, and inert gas such as nitrogen gas or argongas. The gas portion is preferably formed by: providing a coveringmember that includes a second recess at a bottom surface of a firstrecess; filling the second recess with gas such as air; and thereaftermounting the light emitting element in such a manner as to close anopening of the second recess. For ease of manufacture, the gas portionis preferably configured with air.

The gas portion is positioned on the light extraction surface of thelight emitting element. In this manner, light from the light emittingelement can be easily controlled with the gas portion. The shape of thegas portion is the shape of the space between the covering member andthe light emitting element, and defined by the shape of the coveringmember and that of the light emitting element and others being incontact with the gas portion. For example, the upper surface of the gasportion is defined by the surface of the covering member being incontact with the gas portion. The lower surface of the gas portion isdefined by the light extraction surface of the light emitting elementbeing in contact with the gas portion. When a wavelength conversionmember to be described later is provided, the lower surface of the gasportion is defined by the surface of the wavelength conversion memberbeing in contact with the gas portion. The upper surface and the lowersurface of the gas portion may each be a flat surface or a curvedsurface. The upper surface and the lower surface of the gas portion canbe determined as appropriate in order to attain the desired lightdistribution of the light emitting device. The thickness of the gasportion is preferably smaller than the thickness of the light emittingelement. Thus, the light emitting device having a reduced thickness canbe obtained.

The single gas portion may be disposed on the light extraction surfaceof the light emitting element. Alternatively, the plurality of gasportions may be disposed on the light extraction surface of the lightemitting element. The number of the gas portion can be determined asappropriate in order to attain the desired light distribution of thelight emitting device.

The outer edge of the gas portion 50 as seen in a plan view may beformed substantially circular, may be formed to be substantially similarto the outer edge of the covering member as seen in a plan view, oralternatively, may be formed to be substantially similar to the outeredge of the light emitting element as seen in a plan view. The shape ofthe outer edge of the gas portion can be determined as appropriate inorder to attain the desired light distribution of the light emittingdevice.

Preferably, the gas portion is positioned in such a manner as to overlapthe center of the light emitting element as seen in a plan view. Thus,the gas portion is positioned on the optical axis of the light emittingelement, thereby facilitating control of light distribution of the lightemitting device.

In joining the light emitting element 10 and the covering member 40 viathe first light-transmissive member 30, controlling the applicationamount and the application position of the first light-transmissivemember 30 can prevent or discourage the first light-transmissive member30 from entering the gas portion 50.

As seen in a plan view, the outer edge of the gas portion is preferablydisposed on an inner side of the outer edge of the light emittingelement 10. In this manner, the gas portion can be easily formedaccording to a method of manufacturing a light emitting device to bedescribed later.

Due to the good heat dissipation property of the light emitting deviceaccording to the present embodiment, the covering member is less likelyto expand. Consequently, the gas portion is also less likely to deform.Thus, the light distribution property of the light emitting device canbe easily controlled.

Fourth Embodiment

FIG. 4A is a top view showing the schematic structure of a lightemitting device 4000 according to a fourth embodiment. FIG. 4B is asection view taken along line C-C in FIG. 4A. The light emitting device4000 according to the present embodiment is different from the lightemitting device 3000 according to the third embodiment in including awavelength conversion member 60 on the light extraction surface 101. Therest of the structure is the same as or similar to that of the lightemitting device 3000 according to the third embodiment.

Wavelength Conversion Member 60

The wavelength conversion member 60 converts light having a first peakwavelength emitted from the light emitting element into light having asecond peak wavelength which is different from the first peakwavelength. With the wavelength conversion member 60 provided on thelight extraction surface of the light emitting element 10, for example,the covering member can only need to contain a smaller amount or none ofa wavelength conversion material. This facilitates light distributioncontrol with the covering member having a curved surfaced lens portionon its upper surface. The wavelength conversion member 60 may include alight-transmissive portion and a light shielding portion to be describedlater.

The wavelength conversion member 60 may be configured with alight-transmissive material (e.g., resin or glass) containing awavelength conversion substance. In particular, the material of thewavelength conversion member is preferably a resin material. The resinof the wavelength conversion member is preferably a thermosettinglight-transmissive resin such as silicone resin, silicone modifiedresin, epoxy resin, or phenolic resin. In particular, silicone resin issuitable due to its light resistance and heat resistance.

The wavelength conversion substance may be particles of a fluorescentmaterial that can be excited by light emitted from the light emittingelement. Examples of fluorescent materials that can be excited by ablue-color light emitting element or an ultraviolet light emittingelement include: a cerium-activated yttrium-aluminum-garnet-basedfluorescent material (YAG:Ce); a cerium-activatedlutetium-aluminum-garnet-based fluorescent material (LAG:Ce); anitride-based fluorescent material such as a europium and/orchromium-activated nitrogen-containing calcium aluminosilicate-basedfluorescent material (CaO—Al₂O₃—SiO₂:Eu, Cr), a europium-activatedsilicate-based fluorescent material ((Sr,Ba)₂SiO₄:Eu), a β-SiAlONfluorescent material, a CASN-based fluorescent material, or aSCASN-based fluorescent material; a fluoride-based fluorescent materialsuch as a KSF-based fluorescent material; a sulfide-based fluorescentmaterial; a chloride-based fluorescent material; a silicate-basedfluorescent material; a phosphate-based fluorescent material; a quantumdot fluorescent material; or the like. By combining one or more of thesefluorescent materials with a blue light emitting element or anultraviolet light emitting element, a light emitting device of variouswavelengths can be manufactured.

As seen in a plan view, the outer edge of the gas portion is preferablydisposed on an inner side of the outer edge of the wavelength conversionmember. In this manner, the gas portion can be readily formed accordingto a method of manufacturing a light emitting device to be describedlater.

The wavelength conversion member 60 and the covering member 40 arejoined to each other via a second light-transmissive member 31. Thesecond light-transmissive member 31 may be configured with the same orsimilar material to that of the first light-transmissive member 30. Thesecond light-transmissive member 31 is less likely to enter the gasportion 50 by controlling the application amount and the applicationposition of the second light-transmissive member 31. When the wavelengthconversion member 60 is provided, the light emitting element 10 and thewavelength conversion member 60 are joined to each other via the firstlight-transmissive member 30.

Fifth Embodiment

FIG. 5A is a top view showing the schematic structure of a lightemitting device 5000 according to a fifth embodiment. FIG. 5B is asection view taken along line D-D in FIG. 5A. The light emitting device5000 according to the present embodiment is different from the lightemitting device 4000 according to the fourth embodiment in that thewavelength conversion member 60 includes a light-transmissive portion 61and a light shielding portion 62 formed around the light-transmissiveportion 61, and in size of the gas portion as seen in a plan view. Therest of the structure is the same as or similar to that of the lightemitting device 4000 according to the fourth embodiment.

Light-Transmissive Portion 61

The light-transmissive portion 61 may be configured with alight-transmissive material (e.g., resin or glass) containing awavelength conversion substance, and may be made of the materialidentical or similar to that of the wavelength conversion member.

Light Shielding Portion 62

The light shielding portion 62 is a member having a light transmissivitylower than that of the light-transmissive portion with respect to lightfrom the light emitting element. By virtue of the wavelength conversionmember 60 including the light-transmissive portion 61 and the lightshielding portion 62 formed around the light-transmissive portion 61,even though the outer edge of the wavelength conversion member 60 isdisposed on an outer side of the outer edge of the gas portion 50 asseen in a plan view, the outer edge of the gas portion 50 can bedisposed on an outer side of the outer edge of the light-transmissiveportion 61 as seen in a plan view. The wavelength conversion member 60can have an outer edge disposed outwardly of that of the gas portion asseen in a plan view, thereby enabling facilitation of forming the gasportion in a method of manufacturing a light emitting device to bedescribed later.

With the wavelength conversion member 60 including thelight-transmissive portion 61 and the light shielding portion 62, lightemitted from the light emitting element can be mostly output from thelight-transmissive portion 61. The gas portion 50 can have the outeredge disposed outwardly of that of the light-transmissive portion 61 asseen in a plan view, the entire surface of the light-transmissiveportion from which light of the light emitting element is mostly emittedis covered with the gas portion. This facilitates light distributioncontrol of the light emitting device.

Sixth Embodiment

FIG. 6A is a top view showing the schematic structure of a lightemitting device 6000 according to a sixth embodiment. FIG. 6B is asection view taken along line E-E in FIG. 6A. The light emitting device6000 according to the present embodiment is different from the lightemitting device 5000 according to the fifth embodiment in the shape ofthe gas portion 50. The rest of the structure is the same or similar tothat of the light emitting device 5000 according to the fifthembodiment.

The gas portion 50 of the light emitting device 6000 according to thesixth embodiment includes a concave 51 at its upper surface. In otherwords, the covering member 40 includes a curved surfaced protrusion onthe surface facing the light extraction surface 101 of the lightemitting element 10. As seen in a plan view, a lowermost portion 511 ofthe concave 51 at the upper surface of the gas portion 50 substantiallycorresponds to the center of the light emitting element. The gas portion50 including the concave 51 allows light emitted from the light emittingelement to be refracted at the interface between the concave 51 of thegas portion 50 and the covering member 40, so that the light emittedfrom the light emitting element can be condensed. Thus, a light emittingdevice with narrow light distribution can be obtained.

Seventh Embodiment

FIG. 7A is a top view showing the schematic structure of a lightemitting device 7000 according to a seventh embodiment. FIG. 7B is asection view taken along line F-F in FIG. 7A. The light emitting device7000 according to the present embodiment is different from the lightemitting device 6000 according to the sixth embodiment in the shapes ofthe gas portion and the covering member. The rest of the structure isthe same as or similar to that of the light emitting device 6000according to the sixth embodiment.

The gas portion 50 of the light emitting device 7000 according to theseventh embodiment includes a curved surfaced protrusion 52 at its uppersurface. In other words, the covering member 40 includes a concaved atthe surface opposing to the light extraction surface 101 of the lightemitting element. As seen in a plan view, an uppermost portion 521 ofthe protrusion 52 at the upper surface of the gas portion 50substantially corresponds to the center of the light emitting element.The gas portion 50 including the protrusion 52 allows light emitted fromthe light emitting element to be refracted at the interface between theprotrusion 52 of the gas portion 50 and the covering member 40, so thatthe light emitted from the light emitting element can spread. Thus, alight emitting device with wide light distribution can be obtained.

The covering member 40 of the light emitting device 7000 according tothe seventh embodiment includes a depression 41 at the lens portion 401of its upper surface, and includes a protrusion 42 on the outer siderelative to the depression 41 in a plan view. As seen in a plan view,the lowermost portion of the depression 41 of the lens portion 401substantially corresponds to the center of the light emitting element10. Further, a ridge 43 being the uppermost portion of the protrusion 42is formed to be substantially circular as seen in a plan view. Thecovering member 40 including the depression 41 allows light emitted fromthe light emitting element to be refracted at the interface between thedepression 41 of the covering member 40 and outside the light emittingdevice, so that the light emitted from the light emitting element canspread. Thus, a light emitting device with wide light distribution canbe obtained.

It is also possible to condense light emitted from the light emittingelement with the recess 51 of the gas portion 50 as in the lightemitting device 6000 according to the sixth embodiment, and thereafterto spread the light with the depression 41 of the covering member 40 asin the light emitting device 7000 according to the seventh embodiment.Such spreading the condensed light with the covering member facilitateslight distribution control.

Eighth Embodiment

FIG. 8A is a top view showing the schematic structure of a lightemitting device 8000 according to an eighth embodiment. FIG. 8B is asection view taken along line G-G in FIG. 8A. The light emitting device8000 according to the present embodiment is different from the lightemitting device 5000 according to the fifth embodiment in that thecovering member 40 includes a plurality of lens portions 401, and thatthe plurality of lens portions 401 each have the structure of the lightemitting device 5000 according to the fifth embodiment. In other words,the light emitting device 8000 according to the eighth embodiment isdifferent from the light emitting device 5000 according to the fifthembodiment in that the covering members of a plurality of light emittingdevices 5000 according to the fifth embodiment are continuous.

The covering member 40 of the light emitting device 8000 according tothe eighth embodiment includes a plurality of lens portions 401.Further, the light emitting device 8000 according to the eighthembodiment includes light emitting elements 10 respectivelycorresponding to the plurality of lens portions 401. Thus, the lightemission surface of the light emitting device 8000 according to theeighth embodiment can have the total area of the plurality of lensportions 401, thereby enabling increment of the light emission surfacecompared to the area of the lens portion serving as the light emissionsurface of the light emitting device 5000 according to the fifthembodiment. Thus, a light emitting device with a wide light emissionsurface can be obtained. Further, the light emitting device according tothe present embodiment can realize shorter intervals between a pluralityof light emitting elements compared to the intervals between a pluralityof the light emitting devices 5000 according to the fifth embodiment.

Similarly to the second embodiment, the third to eighth embodiments mayalso include conductive members that are electrically connected to apair of electrodes of the light emitting element, with their lowersurfaces exposed outside.

Method of Manufacturing Light Emitting Device 2000 According to SecondEmbodiment

With reference to FIGS. 9A to 9C, a description will be given of amethod of manufacturing the light emitting device 2000 according to thesecond embodiment.

Operation A-1: Providing Light Emitting Element

A light emitting element is provided, which includes a light extractionsurface, an electrode-formed surface on the side opposite to the lightextraction surface, a lateral surface positioned between the lightextraction surface and the electrode-formed surface, and a pair ofelectrodes on the electrode-formed surface.

Operation A-2: Providing Covering Member

As shown in FIG. 9A, the covering member 40 that defines at least onelens portion 401, and the first recess 402 on the side opposite to thelens portion 401 is provided. The covering member 40 is fixed by beingplaced in a retaining member 70, or the like.

Operation A-3: Mounting Light Emitting Element

As shown in FIG. 9B, the light emitting element 10 is mounted on thebottom surface 403 of the first recess 402, having the light extractionsurface 101 of the light emitting element 10 opposed to the first recess402. The light emitting element 10 and the covering member 40 are joinedto each other via the first light-transmissive member 30.

Mounting the light emitting element 10 on the covering member 40 reducesthe probability of misalignment between the covering member 40 and thelight emitting element 10 as compared to the case where the coveringmember is disposed on the light emitting element mounted on the mountingboard. In the case where the covering member is disposed on the lightemitting element mounted on the mounting board, in general, the coveringmember is mounted with reference to a mark placed on the mounting board.Accordingly, when the light emitting element is misaligned on themounting board, misalignment occurs also between the light emittingelement and the covering member. In the manufacturing method accordingto the present embodiment, the light emitting element is mounted on thecovering member 40, therefore, the present embodiment is lesssusceptible to misalignment in mounting the light emitting element onthe mounting board. Thus, the present embodiment can reduce aprobability of misalignment between the covering member 40 and the lightemitting element 10.

Further, when the reflective member covering the lateral surface of thelight emitting element is provided, the outer edge of the light emittingelement is less easily identified, thereby tending to occur consequentlymisalignment between the covering member and the light emitting element.However, in the manufacturing method according to the present embodimentdescribed later, after the light emitting element is mounted on thecovering member, the reflective member covering the lateral surface ofthe light emitting element is formed. Thus, the present embodimentreduces the probability of misalignment between the covering member andthe light emitting element.

Operation A-4: Forming Reflective Member

As shown in FIG. 9C, the reflective member 20 is formed in the firstrecess, in such a manner as to cover the lateral surface of the lightemitting element 10 while exposing a pair of electrodes 11, 12. Thereflective member 20 also covers the first light-transmissive member 30.Further, in the electrode-formed surface 102 of the light emittingelement 10, a portion that is not covered with the pair of electrodes11, 12 may be covered with the reflective member 20. At this time, thethickness of the reflective member 20 (i.e., Z direction) may beadjusted such that part of the pair of electrodes 11, 12 is exposedoutside the reflective member 20. Further, after the reflective memberis formed by a sufficient thickness to embed the pair of electrodes, thereflective member may be removed in such a manner as to expose the pairof electrodes. The reflective member may be removed by a method known inthe art. For example, the reflective member may be removed by etching,cutting, grinding, polishing, blasting or the like.

Operation A-5: Forming Conductive Members

The conductive members that are electrically connected to the pair ofelectrodes of the light emitting element may be formed by sputtering,vapor deposition, atomic layer deposition (ALD), metal organic chemicalvapor deposition (MOCVD), plasma-enhanced chemical vapor deposition(plasma CVD, PECVD), atmospheric plasma deposition, or the like.

Through the operations described above, the light emitting device 2000according to the second embodiment can be obtained. Further, byeliminating the operation of forming the conductive members, the lightemitting device 1000 according to the first embodiment can be obtained.

Method of Manufacturing Light Emitting Device 3000 According to ThirdEmbodiment

With reference to FIGS. 10A and 10B, a description will be given of amethod of manufacturing the light emitting device 3000 according to thethird embodiment.

Operation B-1: Providing Light Emitting Element

Similarly to the method of manufacturing the light emitting device 2000according to the second embodiment, the light emitting element isprovided.

Operation B-2: Providing Covering Member

As shown in FIG. 10A, the covering member 40 is provided, which includesat least one lens portion 401, the first recess 402 on the side oppositeto the lens portion 401, and the second recess 404 provided at thebottom surface 403 of the first recess 402 while having the outer edgedisposed on an inner side of the outer edge of the light extractionsurface of the light emitting element as seen in a plan view. Thecovering member 40 is fixed by being placed in a retaining member 70, orthe like.

Operation B-3: Mounting Light Emitting Element

As shown in FIG. 10B, the light emitting element 10 is disposed on thebottom surface 403 of the first recess 402, having the light extractionsurface 101 of the light emitting element 10 and the bottom surface 403of the first recess 402 facing each other. The light emitting element 10and the covering member 40 are joined to each other via the firstlight-transmissive member 30. In mounting the light emitting element 10,the second recess 404 is closed by the light emitting element 10 and/orthe first light-transmissive member 30 such that the gas portion isformed in the second recess 404. By virtue of the second recess 404having the outer edge disposed on an inner side of that of the lightextraction surface 101 of the light emitting element 10 as seen in aplan view, the second recess can be easily closed. Before mounting thelight emitting element, the second recess is filled with gas such as airor oxygen gas, or inert gas such as nitrogen gas or argon gas.

Operation B-4: Forming Reflective Member

Similarly to the method of manufacturing the light emitting device 2000according to the second embodiment, the reflective member is formed. Theopening of the second recess is closed by the light emitting elementand/or the first light-transmissive member, thereby preventing ordiscouraging the reflective member from entering the second recess.

Through the operations described above, the light emitting device 3000according to the third embodiment can be obtained. Similarly to themethod of manufacturing the light emitting device 2000 according to thesecond embodiment, the operation of forming the conductive members maybe included.

Method of Manufacturing Light Emitting Device 4000 According to FourthEmbodiment

With reference to FIGS. 11A and 11B, a description will be given of amethod of manufacturing the light emitting device 4000 according to thefourth embodiment.

Operation C-1: Providing Light Emitting Element

Similarly to the method of manufacturing the light emitting device 2000according to the second embodiment, the light emitting element isprovided.

Operation C-2: Providing Wavelength Conversion Member

The above-described wavelength conversion member is provided, which isconfigured with a light-transmissive resin or glass material containinga wavelength conversion substance. As described above, the wavelengthconversion member may include the light-transmissive portion and thelight shielding portion.

Operation C-3: Providing Covering Member

A covering member is provided, which includes at least one lens portion,a first recess on the side opposite to the lens portion, and a secondrecess provided at the bottom surface of the first recess while havingthe outer edge disposed on an inner side of the outer edge of thewavelength conversion member in the plan view. The covering member isfixed by being placed in a retaining member or the like.

Operation C-4: Mounting Wavelength Conversion Member

As shown in FIG. 11A, the wavelength conversion member 60 is disposed onthe bottom surface 403 of the first recess 402, with the wavelengthconversion member 60 and the first recess 402 facing each other. Thewavelength conversion member 60 and the covering member 40 are joined toeach other via the second light-transmissive member 31. The secondlight-transmissive member 31 can be prevented or discouraged fromentering the second recess 404 by controlling the application amount andthe application position of the second light-transmissive member 31. AB-staged sheet may be employed as the second light-transmissive member31. This can also prevent or discourage the second light-transmissivemember 31 from entering the second recess 404.

In mounting the wavelength conversion member 60, the second recess 404is closed by the wavelength conversion member 60 and/or the secondlight-transmissive member 31 such that the gas portion is formed in thesecond recess 404. By virtue of the second recess 404 having the outeredge disposed on an inner side of that of the wavelength conversionmember 60 as seen in a plan view, the second recess can be easilyclosed. Before mounting the wavelength conversion member, the secondrecess is filled with gas such as air or oxygen gas, or inert gas suchas nitrogen gas or argon gas.

Operation C-5: Mounting Light Emitting Element

As shown in FIG. 11B, the light emitting element 10 is disposed on thewavelength conversion member 60. The light emitting element 10 and thewavelength conversion member 60 are joined to each other via the firstlight-transmissive member 30.

Operation C-6: Forming Reflective Member

Similarly to the method of manufacturing the light emitting device 2000according to the second embodiment, the reflective member is formed. Theopening of the second recess is closed by the light emitting elementand/or the first light-transmissive member, therefore, the reflectivemember is less likely to enter the second recess.

Through the operations described above, the light emitting device 4000according to the fourth embodiment can be obtained. Further, similarlyto the method of manufacturing the light emitting device 2000 accordingto the second embodiment, the operation of forming the conductivemembers may be included.

Method of Manufacturing Light Emitting Device 8000 According to EighthEmbodiment

With reference to FIGS. 12A and 12B, a description will be given of amethod of manufacturing the light emitting device 8000 according to theeighth embodiment.

Operation D-1: Providing Light Emitting Element

A plurality of light emitting elements is provided, each of which is thesame as or similar to that in the method of manufacturing the lightemitting device 2000 according to the second embodiment.

Operation D-2: Providing Wavelength Conversion Member

A plurality of wavelength conversion members is provided, each of whichwavelength conversion members is the same as or similar to that in themethod of manufacturing the light emitting device 4000 according to thefourth embodiment.

Operation D-3: Providing Covering Member

As shown in FIG. 12A, the covering member is provided, which includes aplurality of lens portions 401, the first recesses 402 on the sideopposite to the lens portions 401, and the second recesses 404respectively positioned at the bottom surfaces 403 of the firstrecesses. Each second recess 404 has the outer edge smaller than that ofcorresponding one of the wavelength conversion members 60 as seen in aplan view. The covering member 40 is fixed by being placed in aretaining member 70, or the like.

Operation D-4: Mounting Wavelength Conversion Member

As shown in FIG. 12B, the wavelength conversion members 60 arerespectively disposed on the bottom surfaces 403 of the first recesses402, with the wavelength conversion members 60 and the first recesses402 facing each other. The wavelength conversion members 60 and thecovering member 40 are joined to each other via the secondlight-transmissive members 31 as in the method of manufacturing thelight emitting device 3000 according to the third embodiment.

In mounting the wavelength conversion members 60 respectively on thebottom surfaces 403 of the first recesses 402, the second recesses 404are respectively closed by the wavelength conversion members 60 and/orthe second light-transmissive members 31, so that a gas portion isformed in each of the second recesses 404. By virtue of the secondrecesses 404 respectively having the outer edges disposed on an innerside of that of the wavelength conversion members 60 as seen in a planview, the second recesses can be easily closed.

Operation D-5: Mounting Light Emitting Elements

The light emitting elements 10 are respectively disposed on thewavelength conversion members 60. The light emitting elements 10 and thewavelength conversion members 60 are respectively joined to each othervia the first light-transmissive members 30.

In the case where the covering member including a plurality of lensportions is disposed on a mounting board such that the lens portionsrespectively straddle a plurality of light emitting elements mounted onthe mounting board, individual positioning adjustment cannot beperformed for misaligned ones of the light emitting elements. Therefore,misalignment occurs between the light emitting elements and the lensportions of the covering member. On the other hand, in the manufacturingmethod according to the present embodiment, the light emitting elementsare respectively disposed on the corresponding lens portions of thecovering member. Accordingly, the present embodiment can reduce aprobability of misalignment in mounting light emitting elements on amounting board. Thus, the present embodiment can realize a lessprobability of misalignment between the light emitting elements and thelens portions of the covering member.

Operation D-6: Forming Reflective Members

The reflective members 20 are respectively formed in the plurality offirst recesses, in such a manner as to cover the periphery of each lightemitting element while exposing the pair of electrodes 11, 12. Thereflective members may be formed in the same or similar manner as themethod of manufacturing the light emitting device 2000 according to thesecond embodiment.

Through the operations described above, the light emitting device 8000according to the eighth embodiment can be obtained. Further, theoperation of forming the conductive members may be included similarly tothe method of manufacturing the light emitting device 2000 according tothe second embodiment.

The light emitting device according to the embodiments of the presentdisclosure and the method of manufacturing the same are applicable tolight sources for various types of applications such as lighting,various types of indicators, vehicular lighting, a display, a liquidcrystal backlight, sensors, signals, vehicular components, and billboardchannel letters.

What is claimed is:
 1. A method of manufacturing a light emitting devicecomprising: providing a light emitting element including a lightextraction surface, an electrode-formed surface on a side opposite tothe light extraction surface, lateral surfaces positioned between thelight extraction surface and the electrode-formed surface, and a pair ofelectrodes on the electrode-formed surface; providing a covering memberincluding a lens portion and a first recess on a side different from thelens portion; disposing the light emitting element on a bottom surfaceof the first recess, with the light extraction surface and the bottomsurface of the first recess facing each other; and forming a reflectivemember in the first recess to cover the lateral surfaces of the lightemitting element while at least a part of the pair of electrodes isexposed from the reflective member.
 2. The method of manufacturing alight emitting device according to claim 1, wherein the providing of thecovering member includes providing the covering member that furtherincludes a second recess at the bottom surface of the first recess, thesecond recess being dimensioned so that an outer edge of the secondrecess is disposed on an inner side of an outer edge of the lightextraction surface of the light emitting element as seen in a plan view,and the disposing of the light emitting element includes covering anopening of the second recess on the bottom surface of the first recesswith the light emitting element.
 3. The method of manufacturing a lightemitting device according to claim 1, wherein the forming of thereflective member includes removing a part of the reflective member toexpose the pair of electrodes.
 4. The method of manufacturing a lightemitting device according to claim 1, further comprising providing anadditional light emitting element, wherein the providing of the coveringmember includes providing the covering member that further includes anadditional lens portion and an additional first recess, and thedisposing of the light emitting element further includes disposing theadditional light emitting element on a bottom surface of the additionalfirst recess.
 5. The method of manufacturing a light emitting deviceaccording to claim 1, wherein the disposing of the light emittingelement includes joining the light emitting element and the coveringmember via a first light-transmissive member.
 6. The method ofmanufacturing a light emitting device according to claim 5, wherein thejoining of the light emitting element and the covering member includesdisposing the first light-transmissive member so that the firstlight-transmissive member is in contact with the lateral surfaces of thelight emitting element.
 7. The method of manufacturing a light emittingdevice according to claim 1, further comprising forming a pair ofconductive members electrically connected to the pair of electrodes. 8.The method of manufacturing a light emitting device according to claim7, wherein the forming of the pair of conductive members includesforming the pair of conductive members so that the pair of conductivemembers are in contact with the reflective member.
 9. The method ofmanufacturing a light emitting device according to claim 7, wherein theforming of the pair of conductive members includes forming the pair ofconductive members so that the pair of conductive members do not contactthe covering member.
 10. The method of manufacturing a light emittingdevice according to claim 7, wherein the forming of the pair ofconductive members includes forming the pair of conductive members sothat outer edges of the pair of conductive members are disposed on aninner side of an outer edge of the reflective member as seen in a planview.
 11. The method of manufacturing a light emitting device accordingto claim 5, further comprising forming a pair of conductive memberselectrically connected to the pair of electrodes so that the pair ofconductive members do not contact the first light-transmissive member.12. The method of manufacturing a light emitting device according toclaim 2, further comprising forming a gas portion in the second recessbetween the light extraction surface of the light emitting element andthe covering member.
 13. The method of manufacturing a light emittingdevice according to claim 12, wherein the forming of the gas portionincludes forming the gas portion so that an outer edge of the gasportion is disposed on an inner side of an outer edge of the lightemitting element, as seen in the plan view.
 14. The method ofmanufacturing a light emitting device according to claim 1, wherein theforming of the reflective member includes forming the reflective memberso that at least the part of the pair of the electrodes is exposedoutside the light emitting device.
 15. The method of manufacturing alight emitting device according to claim 1, wherein the forming of thereflective member includes forming the reflective member so that thereflective member is in contact with at least a part of the lightemitting element.
 16. The method of manufacturing a light emittingdevice according to claim 15, wherein the forming of the reflectivemember includes forming the reflective member so that the reflectivemember is in contact with at least a part of the electrode-formedsurface of the light emitting element.
 17. The method of manufacturing alight emitting device according to claim 1, wherein the forming of thereflective member includes forming the reflective member so that a lowersurface of the covering member is substantially flush with a lowersurface of the reflective member.
 18. The method of manufacturing alight emitting device according to claim 1, wherein the forming of thereflective member includes forming the reflective member so that anouter edge of the reflective member extends along a direction parallelto the lateral surfaces of the light emitting element, in across-sectional view taken along a plane perpendicular to the lightextraction surface of the light emitting element.
 19. The method ofmanufacturing a light emitting device according to claim 8, wherein theforming of the reflective member includes forming the reflective memberso that the reflective member is in contact with at least a part of thelight emitting element.